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689872112

Computer 3d modeling and investigation of the temperature distribution on the component surface (bga microcontroller) of the printed circuit board. Thermal analysis.

Computer 3d modeling and investigation of the temperature distribution on the component surface (bga microcontroller) of the printed circuit board. Thermal analysis.

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Size Width Height Mp
s 500 px 254 px 0.5
m 1000 px 509 px 2
l 2000 px 1017 px 8
xl 3688 px 1876 px 15

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