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Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component.

Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component.

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m 1000 px 563 px 2
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